Adata is always at the cutting edge of technology, providing innovations that help change the way we use tech products. High Five to the team that works on making our lives better, and the world a better and transformed place!
Alex Krivenko
Date: 2023-06-05
the best in Computex 2023
GregL
Date: 2023-05-31
Great value products.. Good stability.. Would use in any system
特點:
支援最新PCIe Gen5 x4介面
循序存取速度高達10,000MB/s
專利設計散熱，透過鋁擠鰭片、大面積風扇主動散熱以及長晶工藝，顯著提升散熱效果
比沒有安裝風扇的SSD多10%的散熱效果
主控: Phison E26
M.2 2280尺寸, 並符合NVMe 2.0
4K隨機存取速度高達 1.4M IOPS
特點:
USB4 40Gbps Type-C 介面
存取速度最高可達3,800/3,200MB/s
專利按壓殼件設計，快速啟動微型風扇達到有效散熱
控制器: Asmedia ASM2464PD
容量: 1TB/2TB
獲獎: Red Dot 2022, CES INNOVATION 2023, Taiwan Excellnece 2023
特點:
針對筆記型電腦、強固型系統應用的新一代記憶體模組
系統滿載時不降速，相較同規格DIMM有更低的延遲
支援LPDDR記憶體，筆記型電腦體積加倍輕薄
相較傳統記憶體厚度減少57%
特點:
符合PCIe 5.0及CXL 1.1通訊協定
支援Intel SPR/AMD Genova最新伺服器應用
單支容量最高達512GB，提升系統記憶體最高達16TB
特點:
超頻時脈達8,400MT/s
使用Rank加速技術，傳輸速度倍增
採用MRCD、MDB等新世代規格零組件，提升速度及穩定性
支援Intel SPR最新伺服器系統
特點:
支援最新PCIe Gen5 x4介面
循序存取速度高達14,000/12,000MB/s
專利散熱設計，鋁合金、水冷液系統與雙風扇的完美結合，呈現驚人散熱效果
比沒有安裝水冷的SSD多20%的散熱效果
主控: Silicon Motion SM2508
M.2 2280尺寸, 符合NVMe 2.0
4K隨機存取速度高達 2M IOPS
特點:
80 PLUS 和 Cybenetics 鈦金等級效率認證。
與 Delta Electronics 台達電子合作研發電源供應器業界最高標準。
符合 Intel ATX 3.0 和 PCIe 5.0 標準。
專利平面變壓器和氮化鎵 MOSFET 解決方案。
經由 XPG PRIME 軟體全數位控制，提供最佳的使用者客製化和數據監控。
特點:
支援 Intel ATX 3.0 設計規範與 12VHPWR (12+4)電源接口。
80 PLUS 與Cybenetics白金認證效能。
聯手Nidec打造高效 XPG VENTO PRO 120 PWM風扇。
全日系 105℃ 電容配置。
特點:
PCIe Gen4x4 interface/ NVMe 1.4 compliant
Up to 4TB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles–improved endurance and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature operation: -40°C to 85°C
AES 256-bit Data Encryption and TCG OPAL 2.0
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for server, networking, surveillance, and IoT related applications
特點:
2.5"" SATA III
Up to 7.68TB
112-layer 3D eTLC NAND flash for higher capacities, efficiency, and durability
7K P/E Cycles – improved endurance and reliability
DWPD>1
Power Loss Protection (PLP)
Tantalum Polymer capacitors with short circuit protection mechanism
Low Power Consumption
Supports SLC Cache and DRAM Buffer
Ideal for 5G networking, IPC, automation, transportation, healthcare and surveillance
特點:
支援最新PCIe Gen5 x4介面
循序存取速度高達14,000/12,000MB/s
專利散熱設計，鋁合金、水冷液系統與雙風扇的完美結合，呈現驚人散熱效果
比沒有安裝水冷的SSD多20%的散熱效果
主控: Silicon Motion SM2508
M.2 2280尺寸, 符合NVMe 2.0
4K隨機存取速度高達 2M IOPS
特點:
支援最新PCIe Gen5 x4介面
循序存取速度高達10,000MB/s
專利設計散熱，透過鋁擠鰭片、大面積風扇主動散熱以及長晶工藝，顯著提升散熱效果
比沒有安裝風扇的SSD多10%的散熱效果
主控: Phison E26
M.2 2280尺寸, 並符合NVMe 2.0
4K隨機存取速度高達 1.4M IOPS
特點:
USB4 40Gbps Type-C 介面
存取速度最高可達3,800/3,200MB/s
專利按壓殼件設計，快速啟動微型風扇達到有效散熱
控制器: Asmedia ASM2464PD
容量: 1TB/2TB
獲獎: Red Dot 2022, CES INNOVATION 2023, Taiwan Excellnece 2023
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles – improved endurance and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature operation: -40°C to 85°C
AES 256-bit Data Encryption and TCG OPAL 2.0
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for server, networking, surveillance, and IoT related applications
特點:
PCIe Gen3x4 interface/ NVMe 1.4 compliant
Up to 2TB of capacity
112-layer 3D TLC NAND flash for higher capacities, efficiency, and durability
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliability
Supports Host Memory Buffer (HMB)
Wide-temperature operation: -40°C to 85°C
LDPC ECC, RAID Engine, and End-to-End (E2E) Data Path Protection
Suitable for automation, servers, data centers, networking, surveillance, and transportatio
特點:
2.5" SATA III
Up to 7.68TB
112-layer 3D eTLC NAND flash for higher capacities, efficiency, and durability
7K P/E Cycles – improved endurance and reliability
DWPD>1
Power Loss Protection (PLP)
Tantalum Polymer capacitors with short circuit protection mechanism
Low Power Consumption
Supports SLC Cache and DRAM Buffer
Ideal for 5G networking, IPC, automation, transportation, healthcare and surveillance
特點:
M.2 2280 SATA III
Up to 2TB
112-layer 3D TLC (BiCS5) flash memory for higher capacities and durability
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliabilitySupports SLC Cache and DRAM Buffer
Wide-temperature support: -40°C to 85°C
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for industrial PCs, embedded devices, automation, networking, surveillance,
特點:
Compliant with SD 6.1 specifications
Up to 512GB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles – improved endurance and reliability
Meets V30 (Video Speed Class) standard
LDPC ECC Technology
Supports Wear Leveling, Garbage Collection and Bad Block Management
Suitable for surveillance, healthcare, POS, in-vehicle, and handheld devices
特點:
Compliant with CFast 2.0 specification
Up to 1TB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature support: -40°C to 85°C
LDPC ECC error correction, RAID Engine, and Wear Leveling
Suitable for automation, IPC, retail (POS, Kiosks), networking, surveillance and healthcare
Feature:
PCIe Gen5 x4 interface
14,000/12,000 MB/s read/write performance
Utilizes innovative cooling design with an extruded aluminum structure, incorporating a built-in water-cooling system and front/rear fans to achieve exceptional heat dissipation
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