Adata is always at the cutting edge of technology, providing innovations that help change the way we use tech products. High Five to the team that works on making our lives better, and the world a better and transformed place!
Alex Krivenko
Date: 2023-06-05
the best in Computex 2023
GregL
Date: 2023-05-31
Great value products.. Good stability.. Would use in any system
Feature:
PCIe Gen5 x4 interface
10,000/10,000MB/s read/write performance
Patented heatsink with miniature fan and surface crystallization increases thermal conductivity
Over 10% better heat dissipation than fanless SSD heatsinks
Controller: Phison E26
M.2 2280 SSD, compliant with NVMe 2.0
4K Random read/write up to 1.4M IOPS
Feature:
USB4 40Gbps Type-C interface
3,800/3,200MB/s Read/Write performance
Patented outer shell can be actuated to activate a built-in micro fan, increasing heat dissipation
Controller: Asmedia ASM2464PD
Capacity: 1TB/2TB
Award winning: Red Dot 2022, CES INNOVATION 2023, Taiwan Excellnece 2023
Feature:
A new generation of memory modules designed for notebook computers and rugged system applications
No speed reduction when the system is fully loaded, with lower latency compared to DIMMs of the same specifications
Supports for LPDDR memory, increases the mobility of notebook computers
Feature:
Compliant with PCIe 5.0 and CXL 1.1 communication protocols
Supports the latest Intel SPR and AMD Genova server applications
A single module has a maximum capacity of 512GB, which can increase maximum system memory up to 16TB
Feature:
Speeds of up to 8,400MT/s for R-DIMM applications
Uses Rank acceleration technology to double transmission speed
Adopts new generation specifications such as MRCD and MDB components to improve speed and stability
Supports latest Intel SPR server systems
Feature:
PCIe Gen5 x4 interface
14,000/12,000 MB/s read/write performance
Patented cooling design: extruded aluminum structure, built-in water-cooling system, and front/rear fans for exceptional heat dissipation
Over 20% better heat dissipation compared to SSDs without water cooling
Controller: Silicon Motion SM2508
M.2 2280 SSD, compliant with NVMe 2.0
4K Random read/write up to 2M IOPS
Feature:
Designed in collaboration with DELTA
Patented Planar Transformer and GaN FET for Xtreme Performance
ATX 3.0 compliant with 2x 12VHPWR (12 + 4) Connectors
Digital control via XPG PRIME software for Fan Curve customization and performance monitoring
Feature:
E-ATX form factor with 4 tempered-glass panels
Compatible with 420mm radiator installation at front
Optional XPG PRIME BOX as an accessory (by model) to synchronize lighting effects
Continuation of award-winning XPG BATTLECRUISER chassis and XPG’s :Exoskeleton design language
Optimized airflow cooling efficiency
Feature:
PCIe Gen4x4 interface/ NVMe 1.4 compliant
Up to 4TB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles–improved endurance and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature operation: -40°C to 85°C
AES 256-bit Data Encryption and TCG OPAL 2.0
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for server, networking, surveillance, and IoT related applications
Feature:
2.5"" SATA III
Up to 7.68TB
112-layer 3D eTLC NAND flash for higher capacities, efficiency, and durability
7K P/E Cycles – improved endurance and reliability
DWPD>1
Power Loss Protection (PLP)
Tantalum Polymer capacitors with short circuit protection mechanism
Low Power Consumption
Supports SLC Cache and DRAM Buffer
Ideal for 5G networking, IPC, automation, transportation, healthcare and surveillance
Feature:
PCIe Gen5 x4 interface
14,000/12,000 MB/s read/write performance
Patented cooling design: extruded aluminum structure, built-in water-cooling system, and front/rear fans for exceptional heat dissipation
Over 20% better heat dissipation compared to SSDs without water cooling
Controller: Silicon Motion SM2508
M.2 2280 SSD, compliant with NVMe 2.0
4K Random read/write up to 2M IOPS
Feature:
PCIe Gen5 x4 interface
10,000/10,000MB/s read/write performance
Patented heatsink with miniature fan and surface crystallization increases thermal conductivity
Over 10% better heat dissipation than fanless SSD heatsinks
Controller: Phison E26
M.2 2280 SSD, compliant with NVMe 2.0
4K Random read/write up to 1.4M IOPS
Feature:
USB4 40Gbps Type-C interface
3,800/3,200MB/s Read/Write performance
Patented outer shell can be actuated to activate a built-in micro fan, increasing heat dissipation
Controller: Asmedia ASM2464PD
Capacity: 1TB/2TB
Award winning: Red Dot 2022, CES INNOVATION 2023, Taiwan Excellnece 2023
Feature:
PCIe Gen4 x4 interface
7,400/6,800 MB/s read/write performance
M.2 2280 SSD, compliant with NVMe 1.4
Works with PS5 as expanded storage
Heatsink provides effective cooling
Capacity: Up to 4TB
Award winning: GOOD Design 2022
Feature:
Supports XMP for Max. Speeds up to 6400 MT/s
Compatible with the latest Intel/AMD platform
Built-in PMIC for Reliable Power Supply
Capacity: 16GB
Operating Voltage 1.1V / 1.4V
Award winning: GOOD Design 2022
Feature:
Supports USB 3.2 Gen2 x2
Performance up to 2000MB/s
Highly portable, lightweight, and compact form factor
Supports new generation game consoles
Supports multiple operating systems support
Feature:
Supports USB 3.2 Gen2
Up to 1000MB/s read/write
Up to 512GB capacity
USB Type-C support for high compatibility
Capless sliding connector
Feature:
SD 8.0 interface with PCIe Gen3 x2 and NVMe 1.3
Over 1,600/1,300MB/s read/write performance
Backward compatible with UHS-I hosts
Built-in LDCP ECC engine for extreme flash endurance
Feature:
Made with 35% recycled plastic
48% reduction of CO2 during manufacturing
Ultra-slim design at just 10.3mm
Up to 2TB capacity
Feature:
Made with 35% recycled plastic that reduces CO2 emissions
Capless swivel design
Interface: USB 3.2 Gen1 (USB 5Gbps)
Feature:
The highest industry-standard used commercially, up to 9,000MT/s
Recognized by the 2022 Red Dot Design Award (2022 Red Dot Design Award Winner)
Compatible with Intel 13th generation （13th-Gen）Raptor Lake systems
Supports Intel® XMP 3.0 for Easy Overclocking
Feature:
Complies with JEDEC DDR5 Registered ECC DIMM design specifications
Compatible with the latest server systems from Intel/AMD
Certified by Intel XMP Lab
Feature:
A new generation of memory modules designed for notebook computers and rugged system applications
No speed reduction when the system is fully loaded, with lower latency compared to DIMMs of the same specifications
Supports for LPDDR memory, increases the mobility of notebook computers
Feature:
Compliant with PCIe 5.0 and CXL 1.1 communication protocols
Supports the latest Intel SPR and AMD Genova server applications
A single module has a maximum capacity of 512GB, which can increase maximum system memory up to 16TB
Feature:
Speeds of up to 8,400MT/s for R-DIMM applications
Uses Rank acceleration technology to double transmission speed
Adopts new generation specifications such as MRCD and MDB components to improve speed and stability
Supports latest Intel SPR server systems
Feature:
Designed in collaboration with DELTA.
Patented Planar Transformer and GaN FET for Xtreme Performance.
ATX 3.0 compliant with 2x 12VHPWR (12 + 4) Connectors.
Digital control via XPG PRIME software for Fan Curve customization and performance monitoring.
Feature:
Intel ATX 3.0 compliant with a 12VHPWR (12 + 4) connector.
Patented Nidec fan design.
80 PLUS Platinum and Cybenetics PLATINUM certified.
100% Japanese Capacitors with 105℃ rating.
8 Industrial Level Protections.
Feature:
Intel ATX 3.0 compliant with a 12VHPWR (12 + 4) connector.
80 PLUS Gold and Cybenetics GOLD certified.
100% Japanese Capacitors with 105℃ rating.
Feature:
13th Gen Intel® Core™ i7-13700H processor
Up to NVIDIA® GeForce RTX™ 4070 laptop GPU
Up to 32GB (16GB*2) ADATA DDR5 5600 Memory SO-DIMM
Compatible with 420mm radiator installation at front.
Optional XPG PRIME BOX as an accessory (by model) to synchronize lighting effects.
Continuation of award-winning XPG BATTLECRUISER chassis and XPG’s :Exoskeleton design language.
Optimized airflow cooling efficiency.
Feature:
PCIe Gen4x4 interface/ NVMe 1.4 compliant
Up to 4TB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles – improved endurance and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature operation: -40°C to 85°C
AES 256-bit Data Encryption and TCG OPAL 2.0
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for server, networking, surveillance, and IoT related applications
Feature:
PCIe Gen3x4 interface/ NVMe 1.4 compliant
Up to 2TB of capacity
112-layer 3D TLC NAND flash for higher capacities, efficiency, and durability
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliability
Supports Host Memory Buffer (HMB)
Wide-temperature operation: -40°C to 85°C
LDPC ECC, RAID Engine, and End-to-End (E2E) Data Path Protection
Suitable for automation, servers, data centers, networking, surveillance, and transportatio
Feature:
2.5" SATA III
Up to 7.68TB
112-layer 3D eTLC NAND flash for higher capacities, efficiency, and durability
7K P/E Cycles – improved endurance and reliability
DWPD>1
Power Loss Protection (PLP)
Tantalum Polymer capacitors with short circuit protection mechanism
Low Power Consumption
Supports SLC Cache and DRAM Buffer
Ideal for 5G networking, IPC, automation, transportation, healthcare and surveillance
Feature:
M.2 2280 SATA III
Up to 2TB
112-layer 3D TLC (BiCS5) flash memory for higher capacities and durability
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliabilitySupports SLC Cache and DRAM Buffer
Wide-temperature support: -40°C to 85°C
LDPC ECC error correction, RAID Engine, and End-to-End Data Path Protection
Suitable for industrial PCs, embedded devices, automation, networking, surveillance,
Feature:
Compliant with SD 6.1 specifications
Up to 512GB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
3K P/E Cycles – improved endurance and reliability
Meets V30 (Video Speed Class) standard
LDPC ECC Technology
Supports Wear Leveling, Garbage Collection and Bad Block Management
Suitable for surveillance, healthcare, POS, in-vehicle, and handheld devices
Feature:
Compliant with CFast 2.0 specification
Up to 1TB
112-layer 3D TLC (BiCS5) NAND flash for higher capacities and endurance
100K P/E cycle rating with upgraded A+ SLC technology for durability and reliability
Supports SLC Cache and DRAM Buffer
Wide-temperature support: -40°C to 85°C
LDPC ECC error correction, RAID Engine, and Wear Leveling
Suitable for automation, IPC, retail (POS, Kiosks), networking, surveillance and healthcare
Feature:
PCIe Gen5 x4 interface
14,000/12,000 MB/s read/write performance
Utilizes innovative cooling design with an extruded aluminum structure, incorporating a built-in water-cooling system and front/rear fans to achieve exceptional heat dissipation
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